Taiwan Semiconductor is realizing its major research projects. They will have volume production of their 3 nanometer chips in 2021 and will get beyond to 2 nanometers and toward 1 nanometer chips in 2023-2025.
2020-2026, Taiwan semiconductor is working specialty on SoC (system on a chip) technology (including new NVM, MEMS, RF, analog) and transistors for 8 – 10 year out horizon.
Beyond the 2nm node, they are working on more advanced 3D transistors, new memory and low-R interconnect.
For 3D IC advanced packaging, TSMC is developing innovations for energy-efficient sub-system integration and scaling to provide further augmentation to CMOS logic applications.
They have an intensified its focus on new specialty technologies such as RF and 3D intelligent sensors targeting 5G and smart IoT applications. They are still working on new materials, processes, devices, nanowires and memories for the long-term, beyond eight to ten years.
Taiwan Semiconductor has over 50% of the semiconductor market and number 2 is Samsung with 18%.
TSMC has a huge potential to capture and drive the smartphone move to 5G.
SOURCES- TSMC Written By Brian Wang, Nextbigfuture.com
Brian Wang is a Futurist Thought Leader and a popular Science blogger with 1 million readers per month. His blog Nextbigfuture.com is ranked #1 Science News Blog. It covers many disruptive technology and trends including Space, Robotics, Artificial Intelligence, Medicine, Anti-aging Biotechnology, and Nanotechnology.
Known for identifying cutting edge technologies, he is currently a Co-Founder of a startup and fundraiser for high potential early-stage companies. He is the Head of Research for Allocations for deep technology investments and an Angel Investor at Space Angels.
A frequent speaker at corporations, he has been a TEDx speaker, a Singularity University speaker and guest at numerous interviews for radio and podcasts. He is open to public speaking and advising engagements.
